Laser Heat Sink Bracket

Laser Heat Sink Bracket

Substrate: 6061 aluminum alloy CNC integrated milling formed, with a machined original color surface. Multi layer parallel heat dissipation fins, bottom positioning protrusions, and front limit steps are processed as a whole without extrusion splicing.
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Description
Technical Parameters
Laser detection module heat dissipation bracket

 

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Material and Processing Technology

Substrate: 6061 aluminum alloy CNC integrated milling formed, with a machined original color surface. Multi layer parallel heat dissipation fins, bottom positioning protrusions, and front limit steps are processed as a whole without extrusion splicing.

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Process characteristics

Dense parallel comb fins: greatly expand the heat dissipation area, quickly dissipate component heat;

Bottom square positioning protrusion: used to insert into the bracket slot for quick positioning and installation;

Front end ladder edge: limit circuit board, sensor, laser module to prevent lateral sliding.

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Material advantages

Aluminum alloy has high thermal conductivity and light weight, suitable for installation on the cantilever of the motion slide table, and will not cause excessive load.

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Structural and functional disassembly

 

1. Upper multi-layer comb shaped heat dissipation fins

Multiple parallel ribs form an efficient heat dissipation surface, which is directly attached to the heating components (drive circuit board, laser module, solenoid valve coil) to quickly dissipate the heat generated by continuous operation, avoiding changes in adhesive viscosity and circuit signal drift caused by high temperature.

2. Front double-layer limit gear platform

Two step structure is used to clamp PCB circuit boards and optical modules, ensuring that the components are tightly attached to the heat dissipation surface, while also playing a role in preventing detachment and limiting.

3. Bottom square positioning tenon

The standard square convex platform can be directly inserted into the positioning groove of the cantilever bracket of the dispensing machine, with fast positioning and ensuring that the heat dissipation surface always remains horizontally attached.

 

Core application scenarios

1. Multi head dispensing machine drive board heat dissipation support (matched with a complete set of modules)

Used for the main control box and cantilever end, to provide heat dissipation for the dispensing valve drive circuit and visual fill light source, stabilize the operating temperature, and ensure long-term batch dispensing consistency.

2. Machine vision light source heat dissipation base

Install circular and coaxial light sources, with comb teeth structure to remove LED heat, prevent light intensity attenuation with temperature rise, and improve visual positioning stability.

3. Laser detection module heat dissipation bracket

Closely attached to the laser emitting module, controlling the temperature of the laser to ensure stable spot size and improve size detection accuracy.

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